Solder Joint Technology

Materials, Properties, and Reliability

By:

King-Ning Tu

Format:

Hardback

Series:

Springer Series in Materials Science

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Description

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

Release date NZ

August 22nd, 2007

Author

King-Ning Tu

Audience

Professional & Vocational

Illustrations

XVI, 370 p.

Pages

370

Series

Springer Series in Materials Science

Dimensions

156x234x23

ISBN-13

9780387388908

Product ID

2435124

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