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RF Measurements of Die and Packages on Hardback by Scott Wartenberg
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RF Measurements of Die and Packages

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Description

This text is dedicated to the issues surrounding RFIC (radio-frequency integrated circuit) testing. It explains how to perform high-accuracy RF measurements of die and packages in the RF test lab. It defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration. This book should be of interest to: RFIC designers and high-frequency digital IC designers, IC test engineers and IC manufacturing test engineers.
Release date NZ
May 31st, 2002
Audiences
  • Professional & Vocational
  • Technical / Manuals
Illustrations
black & white illustrations
Pages
244
Dimensions
156x234x14
ISBN-13
9781580532730
Product ID
5381352

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