Surface Mount Technology

Principles and Practice

By:

Ray Prasad

Format:

Hardback

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Description

This edition continues to focus on educating the electronics engineer in surface mount principles, mainstream industry practices, and technology options. The chapters are a "walk-through" of the actual assembly process. A new chapter discusses the effect of high pin count devices (fine pitch, BGA, and PGA) and their impact on board assembly. Expanded coverage of water soluble paste, no clean paste, and lead free solder addresses the environmental issues current to the industry.

Release date NZ

March 31st, 1997

Author

Ray Prasad

Audiences

Postgraduate, Research & Scholarly
Professional & Vocational

Edition

2nd ed. 1997

Illustrations

3 Illustrations, black and white; XXVIII, 772 p. 3 illus.

Pages

772

Dimensions

156x234x42

ISBN-13

9780412129216

Product ID

2050473

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