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Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6
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Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6

Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics
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Description

Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 of the Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the sixth volume of six from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including: Test Design and Inverse Method Algorithms Inverse Problems: Virtual Fields Method Residual Stresses: Measurement, Uncertainty & Validation Residual Stresses: Eigenvalues, Modeling, & Crack Growth Material Characterizations Using Thermography Fatigue, Damage & Fracture Evaluation Using Infrared Thermography  

Author Biography:

Antonio Baldi – University of Cagliari, Sardinia, Italy; Xavier Balandraud – Sigma Clermont Engineering School, France; Sharlotte L.B. Kramer – Sandia National Laboratories, Albuquerque, NM, USA; Fabrice Pierron – University of Southampton, Southampton, UK; John Considine - United States Forrest Service, Madison, WI, USA; Sven Bossuyt – Aalto University, Aalto, Finland; Johan Hoefnagels – Eindhoven University of Technology, Eindhoven, Netherlands.
Release date NZ
August 26th, 2021
Audience
  • Professional & Vocational
Contributors
  • Edited by Antonio Baldi
  • Edited by Fabrice Pierron
  • Edited by Johan Hoefnagels
  • Edited by John Considine
  • Edited by Sharlotte L.B. Kramer
  • Edited by Sven Bossuyt
Edition
1st ed. 2020
Illustrations
103 Illustrations, color; 24 Illustrations, black and white; VIII, 169 p. 127 illus., 103 illus. in color.
Pages
169
ISBN-13
9783030301002
Product ID
34438702

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