NT-H2 is the further improved second generation of Noctua’s award-winning hybrid thermal compound. Combining the iconic NT-H1’s proven features, superb ease-of-use and renowned long-term stability with a novel, fine-tuned formula of micro particles for even better thermal performance, NT-H2 is an enthusiast-grade paste for the highest demands. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H2 will consistently deliver outstanding results and thanks to the included cleaning wipes, it is just as easy to remove as to apply.
Based on the award-winning NT-H1
NT-H2 is based on Noctua’s renowned NT-H1, which has received more than
150 awards and recommendations from international hardware websites and
magazines. Chosen again and again by overclockers and enthusiast users
worldwide, NT-H1 has established itself as a benchmark for premium-quality
thermal interface materials (TIMs).
Next-generation performance
Further improving the award-winning NT-H1, NT-H2 uses a new, fine-tuned mixture
of metal oxide micro-particles for even lower thermal resistance and reduced
bond-line thickness at typical mounting pressures. This allows it to achieve
even better performance in most application scenarios.
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually
spread NT-H2 before installing the cooler: Simply apply some paste onto the CPU
(see instructions for details), put on the heatsink and you’re ready
to go!
Easy to clean with included wipes
The 10g pack of NT-H2 includes ten large NA-CW1 cleaning wipes that are
pre-moistened with an isopropyl alcohol mixture and make it child’s play to
remove: Simply wipe off the paste from the CPU and the base of the cooler using
one of the wipes and you’re done!
Optional NA-SCW1 set for power users
Power users who take off and install their coolers frequently can purchase the
optional NA-SCW1 set that contains 20 pieces of the NA-CW1 cleaning wipes,
which are ideal for removing NT-H2 from the heat-spreader of the CPU and the
contact surface of the heatsink.
Not electrically conductive, non-corroding
While some high-end thermal compounds and pads are risky to use due to their
electrical conductivity or corroding properties, there’s no risk of
short-circuits with NT-H2 and it’s completely safe to use with any type of
CPU cooler, regardless of whether it’s made from copper or aluminium and
whether it’s nickel-plated or not.
Excellent long-term stability
NT-H2 unique formula is highly stable over time, even after longer periods of
usage. It can be stored at room temperature for at least 3 years and due to the
compound’s exceptional curing, bleeding, dry-out and thermal cycling
characteristics, it can be used on the CPU for 5 years or more.
No break-in or burn-in required
Some thermal compounds need a longer break-in period or cure time until they
reach their full performance and some thermal pads must undergo a dedicated
burn-in process. By contrast, NT-H2 is ready to go right away and doesn’t
require any special preparations.
3.5g package for 3–20 applications
Sufficient for around 3–20 applications (depending on the size of the CPU or
GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for
small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most
users who only install coolers every now and then.
Specifications
- Weight 3.5 g
- Volume 1,2 ml
- Density 2.81 g/cm³
- Colour Grey
- Recommended storage time (before use) up to 3 years
- Recommended usage time (on the CPU) up to 5 years
- Recommended storage temperature room temperature
- Operating temperature –50 to 200°C