Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

Ceramic research and development in Japan

By:

K. Otsuka

Format:

Hardback

Show Hide Adult Content

$860.00

Available from supplier

Usually ships in 3-4 weeks

0 in Trolley

Price Match

Wrap this item as a gift ($5.90) - add a free gift card on the next page

Free Delivery with Primate

Join Now

Free 14 day free trial, cancel anytime.

Buy Now, Pay Later with:

4 payments of $215.00 with Afterpay Learn more

6 weekly interest-free payments of $143.33 with Laybuy Learn more

Availability

Delivering to:

Estimated arrival:

Around 25 Jun - 5 Jul using International Courier

Description

A translation of an important Japanese work on electronic ceramics, this work is particularly concerned with the manufacturing processes of multilayer ceramic substrates for use in semiconductors. This processing technology is important in helping to create efficient high speed devices and has a wide range of applications in many areas of general electronics. In order to improve the dimensional accuracy of alumina ceramic multilayer substrate, theoretical and experimental studies are included concentrating on the process conditions of pwder preparation, mixing, casting, printing, laminating and firing. The relationship between dimensional control and process vairation is described along with an analysis of adhesion in the layers of a tungsten and aluminium substrate.

Release date NZ

April 30th, 1993

Author

K. Otsuka

Audiences

Postgraduate, Research & Scholarly
Professional & Vocational

Illustrations

xiv, 242 p.

Pages

242

Dimensions

178x254x16

ISBN-13

9781851665792

Product ID

2807498

Customer reviews

Nobody has reviewed this product yet. You could be the first!

Write a Review

Marketplace listings

There are no Marketplace listings available for this product currently.
Already own it? Create a free listing and pay just 9% commission when it sells!

Sell Yours Here