MCM C/Mixed Technologies and Thick Film Sensors

Name: MCM C/Mixed Technologies and Thick Film Sensors
SKU: 21691263
Price: 568.00 NZD
Availability: InStock

Format:

Paperback / softback

Series:

NATO Science Partnership Subseries: 3

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Description

Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.

Release date NZ

November 13th, 2012

Audience

Professional & Vocational

Contributors

Edited by Gabor Harsanyi
Edited by Karel Kurzweil
Edited by Sylvia Mergui
Edited by W.K. Jones

Edition

Softcover reprint of the original 1st ed. 1995

Illustrations

X, 318 p.

Pages

318

Series

NATO Science Partnership Subseries: 3

Dimensions

160x240x18

ISBN-13

9789401040396

Product ID

21691263

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