Based on the results of a more than two--year study, Implementing Lead Free Solder in Electronics Manufacturing is the first practical, primary reference to cover Pb--free solder assembly as well as the analysis and reasoning behind the selection of Sn--Ag--Cu as the recommended Pb--free replacement for Sn--Pb. Reflecting the results of a two--year study, Implementing Lead Free Solder in Electronics Manufacturing provides full coverage of the issues surrounding the implementation of Pb--free solder into electronic board assembly. This book is extremely timely most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb--free solder assembly.
Edwin Bradley is a Distinguished Member of the Technical Staff with Motorola Advanced Product Technology Center in Plantation, Florida. He has extensive experience evaluating the materials, assembly processes, and reliability of portable electronic products, with an emphasis on lead-free soldering. Carol A. Handwerker is Professor of Materials Engineering at Purdue University. She is active on the iNEMI Technical and Research Committees. Jasbir Bath is Lead Process Engineer at Solectron Technical Centre in Milpitas, California. He has been chair of various iNEMI lead-free consortia groups. Richard D. Parker has spent nearly forty years at Delphi Electronics & Safety in Kokomo, Indiana, and he has been active in iNEMI since its inception. Ronald W. Gedney retired as vice president of operations at iNEMI and remains on as a consultant. A Fellow of the IEEE, he is also a past president of the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society.