2nd Edition. The almost exponential increase in density, complexity, and performance of integrated circuits over the past ten years (for example, ASIC (Application Specific Integrated Circuit), VHSIC (Very High Speed IC), VLSIC (Very Large Scale IC), and ULSIC (Ultra Large Scale IC) have driven developments in the interconnect substrates culminating in what is now known as multichip modules (MCM). However, the fundamental of design, fabrication, and testing of MCM's are essentially the same as hybrid microcircuits. In the authors' opinion MCM's are extensions of hybrid circuits that can accommodate the new generation of high-speed high performance chips. This revised edition expands the treatment of hybrid circuits without finding it necessary to change the fundamentals. The authors have included a separate chapter on multi-chip modules and throughout the book have included new and emerging materials and processes that are beginning to be used. Examples include: Metal-matrix composites and aluminum nitride ad substrate materials. Plastic encapsulated microcircuits and chip-on-board as low-cost alternatives to hermetic sealed packages, atmospheric friendly cleaning solvents and methods, and advanced high I/O density quad flat packages (QFP) and ball grid array (BCA) packages. Advances in software programs for thermal and electrical analysis and these are covered in this new edition. Contents Include: Introduction: Substrates: Thin Film Processes Deposition Processes Thin Film Resistor Processes Photoresist Material and Processes Etching Material and Processes. Thick Film Processes: Fabrication Processes Direct Writing Paste Materials Non-Noble-Metal Thick Films Polymer Thick Film. Reactor Trimming: Parts Selection Assembly Processes Die and Substrate Attachment Interconnections Cleaning Particle Immobilizing Coating Vacuum-Baking and Sealing. Testing. Handling and Clean Rooms: Handling of Hybrid Circuits Electrostatic Discharge. Design Guidelines. Documentation and Specification. Failure Analysis. Multichip Module.