Non-Fiction Books:

Epoxy Resins and Composites IV

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Paperback / softback
$448.00
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Description



Table of Contents

Dielectric analysis of thermoset cure.- Epoxy-aromatic amine networks in the glassy state structure and properties.- Void growth and resin transport during processing of thermosetting - Matrix composites.- Physical aging in epoxy matrices and composites.- Curing mechanisms and mechanical properties of cured epoxy resins.
Release date NZ
April 17th, 2014
Audience
  • Professional & Vocational
Contributors
  • Contributions by E. S. W. Kong
  • Contributions by E.F. Oleinik
  • Contributions by H. Furukawa
  • Contributions by J.L. Kardos
  • Contributions by M.P. Dudukovic
  • Contributions by N.F. Jr. Sheppard
  • Contributions by R. Dave
  • Contributions by S.D. Senturia
  • Contributions by T. Kamon
  • Edited by Karel Dusek
Edition
Softcover reprint of the original 1st ed. 1986
Illustrations
XIII, 220 p.
Pages
220
Dimensions
170x244x13
ISBN-13
9783662151808
Product ID
22340453

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