Advanced Liquid Metal Cooling For Chip, Device And System

By:

Jing Liu

Format:

Hardback

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Description

This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category — liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system.With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry.

Release date NZ

May 11th, 2022

Author

Jing Liu

Audiences

Professional & Vocational
Tertiary Education (US: College)

Pages

960

ISBN-13

9789811245855

Product ID

35241408

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