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Materials Reliability Issues in Microelectronics: Volume 225 on Hardback
Materials Reliability Issues in Microelectronics: Volume 225 on Hardback
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Materials Reliability Issues in Microelectronics: Volume 225

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Materials Reliability Issues in Microelectronics: Volume 225

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Format:

Hardback
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Description

With the increased complexity of modern integrated circuits, it is important that reliability problems be attacked properly with the appropriate tools. This volume recognizes that almost all reliability problems are materials problems, and helps to put "reliabilty physics" on a firm scientific foundation. Topics include: electromigration; stress effects on reliability; stress and packaging; metallization; device, oxide and dielectric reliability; new investigative techniques; corrosion.
Release date NZ
October 22nd, 1991
Audiences
  • Postgraduate, Research & Scholarly
  • Professional & Vocational
Contributors
  • Edited by Frederick G. Yost
  • Edited by James R. Lloyd
  • Edited by Paul S. Ho
Illustrations
Worked examples or Exercises
Pages
382
Dimensions
155x235x25
ISBN-13
9781558991194
Product ID
14233369

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