16GB (4×4GB) DDR3–1866 CL9 240-Pin DIMM Memory Module Kit, from Kingston's HyperX Predator series.
Push your system to the max. Kingston HyperX Predator DDR3 takes performance to thrilling new extremes with the fastest speeds, lowest latencies and highest capacities available in HyperX memory.
It has a new heat spreader for greater heat dissipation, plus it’s Intel XMP Ready and compatible with all popular brands of motherboards. HyperX Predator is ultra-reliable and 100 per cent factory tested to ensure higher performance, ultra-responsive multitasking and a faster system. HyperX Predator is backed by a lifetime warranty, free technical support and legendary Kingston reliability.
HyperX HX318C9T2K4/16 is a kit of four 512M x 64-bit (4GB) DDR3–1866 CL9 SDRAM (Synchronous DRAM), 1Rx8 memory modules, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 16GB. Each module kit has been tested to run at DDR3–1866 at a low latency timing of 9–10–11 at 1.5V. The SPDs are programmed to JEDEC standard latency DDR3–1600 timing of 11–11–11 at 1.5V. Each 240-pin DIMM uses gold contact fingers.
Engineered and tested to deliver extreme performance, Kingston HyperX easily endures the most rigorous demands of any creative professional, gamer or PC enthusiast.
Features
- Capacity – 16GB (4×4GB Modules)
- Speed – 1866MHz
- 1.5V operating voltage enables stable overclocking
- Intel XMP Ready; optimised performance settings handpicked and tested by Kingston engineers
- Exceptional clock and latency timing specifications to enhance overall system performance
- Heat sink design achieves effective maintenance of speed while prolonging the memory lifecycle
- 100% factory tested
Specifications
CL(IDD) 11 cycles
Row Cycle Time (tRCmin) 48.125ns (min.)
Refresh to Active/Refresh 260ns (min.)
Row Active Time (tRASmin) 35ns (min.)
Maximum Operating Power TBD W* (per module)
UL Rating 94 V – 0
Operating Temperature 0o C to 85o C
Storage Temperature –55o C to +100o C
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11, 10, 9, 8, 7, 6
• Programmable Additive Latency: 0, CL – 2, or CL – 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• Height 2.122” (53.90mm) w/ heatsink, single sided
component