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Power Electronics Packaging Reliability

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Power Electronics Packaging Reliability

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Format:

Hardback
  • Power Electronics Packaging Reliability on Hardback
  • Power Electronics Packaging Reliability on Hardback
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Description

Unpredictable fluctuating loads and exposure to widely varying environmental conditions (including heat, vibration, humidity and dust) present a particularly challenging environment for power electronics modules. This book describes the technologies involved in power electronic device manufacturing with an emphasis on characterising the key wear-out mechanisms and technologies to increase reliability. This book is a must-read for all engineers involved with electronics or reliable power systems.
Release date NZ
June 1st, 2020
Audiences
  • Professional & Vocational
  • Tertiary Education (US: College)
Contributor
  • Edited by Mark Johnson
Country of Publication
United Kingdom
Imprint
Institution of Engineering and Technology
Pages
400
Publisher
Institution of Engineering and Technology
ISBN-13
9781785612527
Product ID
27590809

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